一 | 8月24日消息，据Wccftech报道，SK海力士近日详细阐述了其HBM技术路线图的加速路径，核心举措包括引入EMIB封装方案，并明确将3D集成作为长期目标。 当前，HBM通过TSV（硅通孔）技术将多层DRAM芯片堆叠于基础裸片之上，最高可支持16层堆叠。
二 | HBM与计算模块（XPU，涵盖GPU、TPU等）相互独立，通过2.5D封装共同安装于同一中介层。
每个HBM模块配备1024位I/O接口（共16通道），通过物理接口层（PHY）与XPU相连。而下一代HBM4将首次将I/O接口扩展至2048位，这将是自2015年HBM问世以来的最大规格变革。 在封装工艺上，目前主要存在两大技术路径：热压键合配合非导电膜（TC+NCF）和整体回流焊配合模塑底部填充（MR+MUF）。 Ranveer Singh is currently reeling under the success of his recently released film, Dhurandhar: The Revenge. Both Dhurandhar and its sequel have earned big numbers at the box office and impressed the audience beyond expectations. Now, amid all the love the actor is getting for his performance, he was clicked with his actress-wife Deepika Padukone at a local restaurant. They clicked a selfie with the staff, where Deepika and Ranveer can be seen twinning in black. The couple seemed cheerful and sported wide smiles. The photo also featured Ranveer's father, Jagjit Singh Bhavnani. Take a look at the photo here: Deepika Padukone with Husband Ranveer singh and FIL at a cafe in Mumbai. pic.twitter.com/R8Fj6fugzi — iutlka (@iutlkaa) March 26, 2026 This celebration comes amid Dhurandhar: The Revenge's success, which entered the Rs 1000 crore club within one week of its release. The first part of Dhurandhar, which was released in December 2025, also became a global sensation, earning over Rs 1300 crore worldwide. The Aditya Dhar directorial stars Ranveer Singh as Hamza, an undercover Indian intelligence agent who infiltrates criminal and political networks in Karachi to dismantle a terror cell. The sequel, Dhurandhar: The Revenge, which was released on March 19, explores the rise of Hamza while delving into his origins as Jaskirat Singh Rangi. The star-studded cast of the sequel also includes Sanjay Dutt, Arjun Rampal, R. Madhavan, Sara Arjun, Rakesh Bedi, Gaurav Gera and Danish Pandor, among others. Filmfare rated the film 3.5 out of 5 and wrote in its review, "Ultimately, this is Ranveer Singh’s show, and he commits to it wholeheartedly. His dual portrayal, lean, impulsive Jaskirat and the bulked-up, calculating Hamza, is convincing, even if the character occasionally veers into full-blown patriotic poster boy territory. He embodies both the emotional turmoil and the ruthless efficiency the role demands, anchoring the film even when the script threatens to spiral. He literally has given his 110 per cent to the film and given the hint of a sequel, be prepared for more of Hamza in the future." Also Read: Ranveer Singh Sparks Fan Frenzy Post Dhurandhar 2’s Success, Babbar Sher Chants Go Viral。前者在应对芯片翘曲方面更具优势，但热阻较高且生产效率偏低；后者生产效率更高、热阻更低，却更易出现翘曲及间隙填充缺陷。
三 |
面向未来，SK海力士计划引入混合键合技术，以消除芯片堆叠中的凸块并缩小间距。同时，公司正在开发名为“I-HBM”的局部散热技术（类似三星的HPB方案），旨在优化传热路径，更高效地分散热量，为更高层数的堆叠铺路。 在2.5D封装解决方案方面，SK海力士目前已在传统CoWoS-L、CoWoS-R和CoWoS-S之外，新增了英特尔的EMIB技术，形成更丰富的异构集成选项。 此外，市场传言SK海力士与英特尔有望在存储领域组建合资公司，进一步深化合作。
四 | 同时，与三星类似，SK海力士也在积极推进3D垂直堆叠方案，将HBM直接置于计算模块之上，以突破现有封装架构的带宽和能效瓶颈。
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